File Name: reliability of mems testing of materials and devices .zip
Many highly integrated and easy to deploy condition monitoring products are appearing on the market that employ a micro electromechanical system MEMS accelerometer as the core sensor.
Not a MyNAP member yet? Register for a free account to start saving and receiving special member only perks.
We apologize for the inconvenience...
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Professional Materials Engineers working with materials used in electronic devices, including silicon chips; Electronics Engineers; Electrical Engineers; Manufacturing Engineers; Chemical Engineers. From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.
New methods are needed in microsystems technology for evaluating microelectromechanical systems MEMS because of their reduced size. The assessment and characterization of mechanical and structural relations of MEMS are essential to assure the long-term functioning of devices, and have a significant impact on design and fabrication. Within this study a concept for the investigation of mechanically loaded MEMS materials on an atomic level is introduced, combining high-resolution X-ray diffraction HRXRD measurements with finite element analysis FEA and mechanical testing. Latter were calculated by a specifically developed, simple and fast approach on the basis of continuum mechanical relations. Qualitative and quantitative analysis confirmed the admissibility and accuracy of the presented method.
We apologize for the inconvenience...
Nanoelectromechanical systems NEMS are a class of devices integrating electrical and mechanical functionality on the nanoscale. NEMS typically integrate transistor-like nanoelectronics with mechanical actuators, pumps, or motors, and may thereby form physical, biological, and chemical sensors. The name derives from typical device dimensions in the nanometer range, leading to low mass, high mechanical resonance frequencies, potentially large quantum mechanical effects such as zero point motion , and a high surface-to-volume ratio useful for surface-based sensing mechanisms. As noted by Richard Feynman in his famous talk in , " There's Plenty of Room at the Bottom ," there are many potential applications of machines at smaller and smaller sizes; by building and controlling devices at smaller scales, all technology benefits. The expected benefits include greater efficiencies and reduced size, decreased power consumption and lower costs of production in electromechanical systems. In , Mohamed M. Further devices have been described by Stefan de Haan.
This 22 standard series starts from the basics with terms, definitions, and general specs, and continues on to a range of measurements and test methods such as those for fatigue, compression, bending, and shearing. IEC defines terms for micro-electromechanical devices including the process of production of such devices. This edition includes the following significant technical changes with respect to the previous edition: a removal of ten terms; b revision of twelve terms; c addition of sixteen new terms.